01 Thermal pathways for advanced integration 面向先进集成的热通路
We investigate how heat is generated and transported across materials, interfaces, devices, interconnects, and package structures in high-performance chips, heterogeneous integration, and advanced packaging. We develop high-thermal-conductivity materials, interface engineering, advanced thermal characterization, and thermal-management technologies for three-dimensional integration.
我们面向高性能芯片、异质集成与先进封装，研究热量在材料、界面、器件、互连和封装结构中的产生与传递，并发展高导热材料、界面调控、先进热表征和三维集成热管理技术。
02
As chips move toward higher power density and greater integration, thermal challenges shift from external cooling into the chip structure. Local hotspots, inter-layer thermal coupling, interface resistance, and constrained vertical pathways jointly affect performance, reliability, and integration architecture.
随着芯片向更高功率密度和更高集成度发展，热问题已经从外部散热进入芯片结构内部。局部热点、层间热耦合、界面热阻和受限的垂直热通路，共同影响芯片的性能、可靠性与集成方式。
In 2.5D and 3D systems, materials, interconnect structures, bonding processes, and package architectures together determine total thermal resistance. Thermal management has therefore become an integral part of advanced integration technology.
在2.5D与3D集成系统中，材料选择、互连结构、键合工艺和封装架构同时决定最终热阻。热管理因此成为先进集成技术的重要组成部分。
03
Growth, thermal transport, and size effects in high-thermal-conductivity semiconductors and heat-spreading materials, including diamond, AlN, SiC, and related materials.
研究高导热半导体与热扩散材料的生长、热输运和尺寸效应，关注金刚石、AlN、SiC及相关材料在芯片热管理中的应用。
Heat transfer across heterogeneous interfaces, buried interfaces, and bonding layers, with emphasis on how interfacial structure and processing determine thermal resistance.
研究异质材料界面、埋层界面和键合层中的热传递，揭示界面结构与制备工艺对热阻的影响。
Local hotspots in micro- and nanoelectronic devices, effective thermal conductivity of BEOL and advanced interconnects, and heat-spreading paths in complex device structures.
研究微纳电子器件中的局部热点、BEOL与先进互连的有效热导率，以及复杂器件结构中的热扩散路径。
Co-design of heat-spreading layers, high-conductivity pathways, and package structures for chiplet integration, 3D stacking, and advanced packaging.
面向芯粒集成、三维堆叠和先进封装，探索热扩散层、高导热通路与封装结构协同设计，提升集成系统的散热能力与可靠性。
04
TDTR, FDTR, SSTR, and thermal imaging in real process structures
TDTR、FDTR、SSTR及热成像，获得真实工艺结构热参数
Heat-transfer models, sensitivity analysis, atomic-scale characterization, and uncertainty
传热模型、敏感度分析、原子级表征与不确定性评估
High-conductivity materials, interface engineering, heat spreaders, and local pathways
高导热材料、界面工程、热扩散层与局部热通路设计
Heterogeneous integration, 3D stacking, and advanced packaging
将材料与界面研究转化到异质集成、三维堆叠与先进封装
Experimental verification feeds the next design cycle
通过实验验证热管理效果，进入下一轮优化
05
A 3D-IC places chiplets, interconnects, and bonding interfaces within a confined volume. Every layer and interface can limit the thermal pathway.
3D-IC将多个芯粒、互连和键合界面集成在有限空间内。每一层材料和每一个界面都可能成为热通路中的限制因素。
Can high-thermal-conductivity films retain their material advantage at device-relevant thicknesses, and how do grain boundaries, dimensions, and defects change thermal conductivity?
高导热薄膜能否在实际厚度下保持材料优势？晶界、尺寸和缺陷如何影响薄膜热导率？
How do local hotspots and thermal coupling between chiplets affect performance and reliability?
局部热点和不同芯粒之间的热耦合如何影响性能与可靠性？
How do advanced interconnects and low-k dielectrics change the effective vertical thermal pathway?
先进互连和低介电常数材料如何改变垂直热通路与有效热导率？
Does the bonding interface become a dominant thermal resistance in the stack?
混合键合界面是否构成热通路中的主要热阻？
How can heat-spreading layers and high-conductivity pathways be embedded in 3D-ICs to improve system-level heat dissipation?
热扩散层和高导热通路如何嵌入3D-IC，并提升跨层热通路与系统散热能力？
06
Advanced thermal characterization is a core research capability for developing thermal-management and integration technologies. The platform combines optical thermal metrology, thermal imaging, customized model fitting, and automated data processing to study and validate materials, devices, interconnects, and packages.
先进热表征是实验室发展热管理与集成技术的核心研究能力。平台集成多种光学热测量系统、热成像技术、定制化模型拟合与自动化数据处理，支持材料、器件、互连和封装结构的研究与验证。
07
We develop a complete research chain spanning heat-transport mechanisms, advanced characterization, materials and interface control, heterogeneous integration, and advanced-packaging applications to deliver verifiable thermal-management technologies for high-performance integrated circuits.
我们致力于建立从热输运机理、先进表征和材料界面调控，到异质集成与先进封装应用的完整研究链路，为高性能集成电路提供可验证的热管理技术。