Facilities

The laboratory operates a comprehensive chip thermal-measurement platform with internationally advanced technical capabilities, covering nearly all major methods for chip thermophysical-property characterization and micro/nanoelectronic device thermometry. Supported by two National Key Laboratories in the School and process lines at leading domestic integrated-circuit companies, the platform targets the increasingly severe heat-dissipation bottlenecks and instrumentation-access challenges in next-generation 3D stacked devices and chips, as well as power and RF electronics.

实验室建有系统全面、技术世界前列的芯片热量测平台，基本上集齐了所有的芯片热物性和微纳器件测温设备。依托本学院两个全国重点实验室及国内头部集成电路企业工艺线，立志于解决下一代三维堆叠器件/堆叠芯片以及功率/射频芯片中日益严重的散热瓶颈和设备禁运问题。